Recently, REWA Academy students returned feedback that the two strata often fail to fit closely in double-stacked motherboard repair There are even vast cracks, starting pseudo soldering In response, we will share gratuities and mentions when separating and recombining double-stacked motherboard Peel off foam on the motherboard before heating Please be noted that we do not recommend amateurs to heat the motherboard with a hot air gun Because the motherboard may receive heat unevenly and deform A professional motherboard heating scaffold is something we indicate To facilitate last-minute removal of the logic timber, drive a fasten on the reasoning card Cut through the videotape with a Sculpture Knife The logic board and middle bed are soldered with low-temperature solder paste So the best temperature for the heating pulpit is likely to be 155 C-1 65 C Push the reasoning timber gently with tweezers when the temperature contacts 165 C If the reasoning board is loose, the tin has defrosted Clamp the fucking to remove the logic board Remove the signal timber Remove thermal grease with a Sculpture Knife Thermal grease must be removed absolutely Otherwise, the thermal grease will touch the logic card to give rise to pseudo soldering in recombination Attach the signal board to the holder Apply a round of Paste Flux Remove tin on the bonding pad with Soldering Iron at 365 C and Solder Wick Tin on the bonding pad must be completely removed The residual tin will affect the subsequent soldering Clean the bonding pad with PCB Cleaner Clean the logic committee with the same method Please do not damage ingredients in different areas of the bonding pad of the reasoning card while emptying It to check if the bonding pad is nifty after scavenge Attach the signal committee to the Reballing Platform Put the reballing stencil in position to make sure that it is pressing against the signal board To frustrate the solder paste from flowing into the motherboard gap, implant a metal plateful Apply a blanket of low-temperature Solder Paste Wipe off plethora solder paste with a Lint-free Wipe Remove the reballing stencil Check if solder adhesive on the signal timber is full While applying solder paste, please made to ensure that solder glue must have a certain humidity If the solder adhesive is too dry, it will adhere to the reballing stencil when the stencil is removed As a reaction, the solder paste on the signal council is not be attire, which can easily lead to poor soldering Put the signal board on the 165 C Heating Platform to heat Stop heating after the solder balls are constituted Apply a small amount of Paste Flux after the signal board has cooled Align the reasoning committee with the signal card Keep heating on the 165 C Heating Platform When the solder flow sheds and reasoning council capsizes, nudge the reasoning card gently with tweezers to ensure the two layers fit closely The nudge must be gentle and tiny Clean the motherboard with PCB Cleaner after the motherboard has cooled If you find the motherboard deformed while recombining, you can applied the motherboard on a flat card and fasten it with a rubber band Press two sides of the motherboard gently To escape squeeze constituents, delight placed a soft paper under the motherboard Next, we will share another recombination procedure The technique can be taken if the centre bonding pad is not marred When the tin softens, remove the logic board in a vertical behaviour with tweezers It can be seen that there is a metal pad of 0.05 mm thickness around the signal board at a certain distance This metal pad is designed to keep a 0.05 mm breach between the logic timber and the middle-of-the-road stratum, thwarting the solder chunks from connecting while soldering You exclusively need to remove thermal grease on the motherboard when the restore is done Keep original tin on the bonding pad Apply a small amount of Paste Flux Lastly, align the reasoning timber with the signal board When the temperature reaches 165 C and the tin meltings, turn the dominance off Press two missions of the reasoning timber with tweezers until the motherboard has cooled The logic timber and the signal committee fit closely in this way There is likely to be no bridging and solder projectiles spillover Visit REWA Academy if you want to learn more repair knowledge We have terminated course boxes for motherboard diagnosis and repair ability improvement Click the link in the comment section to purchase motherboard repair course packs Thank you for watching and feel free to leave a comment
