iPhone X-12 Double-stacked Board Separation & Recombination | REWA Academy Tips

Just Recently, REWA Academy trainees gave feedback that the 2 layers commonly stop working to fit very closely in double-stacked motherboard fixing There are even big voids, causing quasi soldering In reaction, we will share tips as well as notes when separating and recombining double-stacked motherboard Peel off foam on the motherboard prior to heating Please be kept in mind that we do not advise beginners to heat the motherboard with a hot air gun Since the motherboard may get warm erratically and also warp A professional motherboard heating platform is what we recommend To promote later on removal of the logic board, drive a screw on the logic board Puncture the tape with a Sculpture Knife The logic board and center layer are soldered with low-temperature solder paste So the best temperature for the home heating platform will be 155 ° C-165 ° C Push the logic board gently with tweezers when the temperature level reaches 165 ° C If the logic board is loosened, the tin has actually melted Clamp the screw to remove the reasoning board Remove the signal board Eliminate thermal oil with a Sculpture Knife Thermal grease should be removed totally Or else, the thermal grease will touch the reasoning board to generate pseudo soldering in recombination Affix the signal board to the holder Use a round of Paste Flux Remove tin on the bonding pad with Blowpipe at 365 ° C and also Solder Wick Tin on the bonding pad have to be totally eliminated The recurring tin will certainly impact the succeeding soldering Clean the bonding pad with PCB Cleaner Clean the logic board with the same technique Please do not damage components around the bonding pad of the logic board while cleaning It is needed to examine if the bonding pad is cool after cleaning Affix the signal board to the Reballing System Placed the reballing stencil in position to make certain that it is pushing against the signal board To stop the solder paste from streaming into the motherboard gap, put a steel plate Use a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Remove the reballing stencil Examine if solder paste on the signal board is full While applying solder paste, please make certain that solder paste must have a specific humidity If the solder paste is also completely dry, it will comply with the reballing stencil when the stencil is eliminated Therefore, the solder paste on the signal board will certainly not be uniform, which can easily bring about inadequate soldering Placed the signal board on the 165 ° C Heating System to heat Stop heating after the solder spheres are formed Apply a percentage of Paste Change after the signal board has cooled Align the reasoning board with the signal board Maintain home heating on the 165 ° C Heating System When the solder change spills as well as logic board sinks, push the logic board carefully with tweezers to make sure both layers fit very closely The push needs to be mild and also little Tidy the motherboard with PCB Cleanser after the motherboard has actually cooled down If you locate the motherboard warped while recombining, you can put the motherboard on a level board and also attach it with an elastic band Press 2 sides of the motherboard delicately To prevent squashing components, please place a soft paper under the motherboard Next, we will certainly share another recombination technique The method can be taken if the middle bonding pad is not harmed When the tin thaws, remove the logic board in a vertical fashion with tweezers It can be seen that there is a steel pad of 0.05 mm thickness around the signal board at a particular distance This metal pad is made to maintain a 0.05 mm gap between the reasoning board and also the center layer, stopping the solder rounds from bridging while soldering You only require to remove thermal grease on the motherboard when the repair is done Maintain initial tin on the bonding pad Apply a percentage of Paste Flux Lastly, line up the logic board with the signal board When the temperature level reaches 165 ° C and the tin thaws, turn the power off Press 2 ends of the logic board with tweezers till the motherboard has actually cooled down The logic board as well as the signal board fit closely in this method There will be no bridging as well as solder balls spillover See REWA Academy if you intend to learn more fixing skills We have complete program bundles for motherboard medical diagnosis as well as repair capability enhancement Click the web link in the remark area to purchase motherboard repair program plans Thank you for enjoying and also do not hesitate to leave a remark

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