In our last video clip, we did a teardown on iPhone 13 Pro Today we will certainly separate the motherboard of apple iphone 13 Pro to share motherboard differences as well as repair service difficulty In the initial location, we benchmark iPhone 13 Pro as well as iPhone 12 Pro at the same time Through LINCSEEK Infrared Thermal Video Camera, it is found that iPhone 13 Pro obtains hotter than iPhone 12 Pro apple iphone 13 Pro can reach a maximum temperature of around 48 ° C while the optimum temperature level of iPhone 12 Pro is around 40 ° C Then we divide the motherboard of iPhone 13 Pro to view its indoor framework and find out what has created the overheating In the meanwhile, we will certainly walk you via how to separate and also recombine the motherboard iPhone 13 Pro'' s motherboard is designed to be more compact to leave even more space for the battery Furthermore, the motherboard no much longer uses an L-shaped style Get rid of the motherboard The double-layered design is still used SIM card viewers is not stand-alone and also is welded to the motherboard For far better warm dissipation, both sides of the motherboard are covered with thick warmth dissipation tapes After that we remove foam on the motherboard Get rid of tape on the motherboard with Hot Air Gun at 100 ° C It can be seen that NAND is under the A15 tape Continue to get rid of tapes on the back of the motherboard Warmth dissipation tapes on the motherboard are recyclable Please do not damage the tapes throughout fixing to stay clear of influencing the warmth dissipation effect after setting up We found that the back of apple iphone 13 Pro’s signal board has parts Please listen not to damage the parts while separating Because the home heating platform for apple iphone 13 Pro has not come out yet, we make use of a global heating platform at 170 ° C for splitting up Because the middle layer of apple iphone 13 lineup’s motherboard still makes use of middle-temperature Solder Paste for soldering Add warm with Hot Air Gun at 330 ° C around the motherboard, when the temperature level of the Home heating Platform reaches 150 ° C As the reasoning board becomes loosened, remove the logic board with tweezers Please do not damage surrounding elements while eliminating The CPU is stacked with the baseband which misbehaves for motherboard warm dissipation Then we eliminate thermal grease on the chips The dimension of A15 has actually raised a whole lot, that makes CPU desoldering extra tough The apple iphone 13 Pro'' s baseband CPU has been upgraded to the Qualcomm X60 It is believed that the phone signal will certainly be extra stable than previous designs Then we see if a solitary reasoning board of iPhone 13 Pro can cause the boot-up Power the reasoning board with a Straight Current Supply Attach the screen Trigger the boot-up with tweezers We can see that apple iphone 13 Pro took longer to set off the boot-up than previous designs It takes 8-10 seconds for the Apple logo design to appear on the display This might be triggered by the system After that we recombine the signal board with the reasoning board Apply some Paste Change to the bonding pads of the signal board To better tidy tin subsequently, use some low-temperature Solder Paste to neutralize the temperature level of the bonding pads Tidy the bonding pads with Soldering Iron at 380 ° C and also solder wick Apply solder paste to the bonding pads of the logic board Please do not impact bordering elements while applying solder paste This ought to likewise be kept in mind while making use of Welding torch to remove tin Tidy the bonding pads with PCB Cleaner After that we reball the signal board Connect the signal board to the Reballing Platform Placed the reballing stencil in position Apply middle-temperature Solder Paste equally Remove the reballing stencil Placed the signal board on the Heating Platform to warm After the solder balls are created, cool the signal board Use some Paste Change to the bonding pads Line up the reasoning board with the signal board Maintain home heating with the Home heating System at 170 ° C Add warm around the motherboard with Hot Air Weapon at 330 ° C After the motherboard has cooled down, separate the motherboard Reattach foam as well as warmth dissipation tapes to the motherboard Mount the motherboard for screening The phone transforms on typically In recap, with this splitting up, it is located that iPhone 13 Pro still has a double-layered motherboard The motherboard has some changes in appearance however there is little modification in the main chip distribution In addition, the CPU and also baseband are piled, which not only increases the problem of fixing yet additionally makes the motherboard warm up easily Under specific conditions, the motherboard is most likely to have problems For your referral, this is the motherboard chip circulation diagram of iPhone 13 Pro from iRepair Thanks for enjoying
