Just Recently, REWA Academy pupils provided feedback that both layers often fall short to fit very closely in double-stacked motherboard fixing There are even large spaces, triggering quasi soldering In reaction, we will share pointers and notes when separating and also recombining double-stacked motherboard Peel off foam on the motherboard prior to heating Please be kept in mind that we do not suggest newbies to heat up the motherboard with a hot air weapon Due to the fact that the motherboard might receive heat erratically as well as warp A professional motherboard home heating platform is what we suggest To promote later elimination of the reasoning board, drive a screw on the reasoning board Puncture the tape with a Sculpture Knife The reasoning board and center layer are soldered with low-temperature solder paste So the most effective temperature level for the home heating platform will certainly be 155 ° C-165 ° C Push the logic board gently with tweezers when the temperature level reaches 165 ° C If the reasoning board is loosened, the tin has melted Clamp the screw to remove the logic board Remove the signal board Get rid of thermal grease with a Sculpture Knife Thermal oil should be removed completely Or else, the thermal grease will touch the logic board to offer increase to pseudo soldering in recombination Affix the signal board to the holder Use a round of Paste Change Remove tin on the bonding pad with Soldering Iron at 365 ° C and Solder Wick Tin on the bonding pad should be completely eliminated The residual tin will impact the succeeding soldering Clean the bonding pad with PCB Cleanser Clean the reasoning board with the exact same method Please do not damage components around the bonding pad of the reasoning board while cleaning It is needed to check if the bonding pad is cool after cleaning Attach the signal board to the Reballing Platform Put the reballing stencil in placement to see to it that it is pushing against the signal board To avoid the solder paste from moving right into the motherboard void, put a steel plate Apply a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Get rid of the reballing stencil Inspect if solder paste on the signal board is full While using solder paste, please make certain that solder paste must have a certain moisture If the solder paste is as well dry, it will certainly follow the reballing pattern when the stencil is gotten rid of As a result, the solder paste on the signal board will certainly not be consistent, which can quickly result in poor soldering Put the signal board on the 165 ° C Home heating System to warm Quit home heating after the solder balls are formed Apply a small amount of Paste Change after the signal board has cooled down Align the reasoning board with the signal board Maintain home heating on the 165 ° C Heating Platform When the solder change spills and reasoning board sinks, push the logic board carefully with tweezers to guarantee the two layers fit very closely The push has to be gentle and small Clean the motherboard with PCB Cleaner after the motherboard has actually cooled If you find the motherboard warped while recombining, you can place the motherboard on a level board and also fasten it with an elastic band Press two sides of the motherboard delicately To prevent squashing components, please place a soft paper under the motherboard Next, we will share another recombination method The technique can be taken if the middle bonding pad is not harmed When the tin melts, remove the logic board in a vertical manner with tweezers It can be seen that there is a steel pad of 0.05 mm thickness around the signal board at a specific distance This metal pad is developed to maintain a 0.05 mm gap in between the reasoning board as well as the center layer, stopping the solder spheres from connecting while soldering You just require to get rid of thermal oil on the motherboard when the repair service is done Keep initial tin on the bonding pad Apply a percentage of Paste Change Lastly, line up the logic board with the signal board When the temperature gets to 165 ° C and also the tin melts, transform the power off Press 2 ends of the logic board with tweezers until the motherboard has cooled The reasoning board and also the signal board fit closely this way There will be no bridging and also solder spheres spillover See REWA Academy if you want to find out more repair service skills We have total program packages for motherboard diagnosis and also repair service capability enhancement Click the link in the comment area to purchase motherboard repair service training course plans Thanks for viewing and really feel free to leave a comment
