Phone is terribly harmed Display is torn and also back glass is busted Center framework is warped Get rid of display assembly Face ID and back electronic camera components look okay Motherboard also looks excellent Battery is badly warped Install brand-new display screen assembly Connect battery port with DC power On Phone works typically The touch screen is not reacting Obtain the motherboard We can see that there is a noticeable gap in between the PCB The third space and also the bottom layer The lower layer is terribly deformed We require to replace the lower layer Placed the motherboard on the hot pad Home heating for numerous mins and after that get rid of the leading layer Continue to affix the leading layer to the double stand PCB Eliminate the thermal substance covering the CPU and afterwards warmth with a blowpipe at 365 ℃ Clean the bonding pads around the side with solder wick We can see that numerous pads appeared of the board Amongst these pads are missing out on, S7, S8 S11 and S12 important signal pins We require to treat it by leaping the stud cables are ground pins and also test pins we can simply leave them alone Use a splice flow to the missing out on 4 signal pins obtain filthy Usage the sharp soldering iron and solder 0.02 mm enameled copper cord to the 4 missing out on pads in a row Once finished, cut off the excess wire with the carving knife and after that circle the cable around the missing out on pad Use some UV treatable solder mask Freeze under UV clothes dryer light for 5 minutes Keep in mind To scratch off the excess UV-curable solder mask Ensure the soldered cord is exposed Affix a great base layer understood to the examination installations then the top layer Link the display assembly Connect the battery port to DC Power on the motherboard with tweezers Phone functions normally Touch function Likewise typical judging by that, the touch problem is triggered by the substrate due to the fact that the substratum is terribly warped We need to transplant the baseband CPU, the base EEPROM and the NFC chip on the original substrate to a new substrate Affix the brand-new underlayment to a multi-Back Preheat chlorine with a warm air weapon at 280 ℃ to remove the black glue around the CPU for the baseband and after that heat with hot air gun at 360 ° C Separate the baseband CPU, the baseband EEPROM and also the NFC chip from the brand-new bottom layer Clean the 3 bonding pads after that continue to connect the original bottom layer to the PCB holder Preheat with Hot air gun to eliminate baseband CPU as well as baseband EEPROM and also NFC chip Clean the residual solder and also black adhesive on the baseband CPU with a soldering iron Get the baseband CPU and also baseband EEPROM as well as NFC chip Solder the baseband NFC chip and EEPROM and baseband CPU to the brand-new bottom layer Attach the initial leading layer as well as brand-new bottom layer to the test fittings Link the display assembly Attach the battery adapter to DC Power on the motherboard with tweezers Go to Settings > > General > About Below we can locate the IMEI identification number As well as the modem firmware showing that the reduced layer swaps The next point we do is solder both layers with each other Attach the brand-new bottom layer to the specialized restoration pass away Cover the brand-new lower layer with the matching replacement stencil Smear some reduced solder paste onto the stencil Once done eliminate the duplicate pattern carefully Continue positioning the new bottom layer on Heating system as solder paste thaws Solder rounds begin developing as soon as ended up Wait on lower layer to cool for 10 minutes Remain to use BGA Paste Flux to PCB Third area Placed leading layer in position Heat up for 1 min on hot pad at 160 ℃ with layer sinking Leading as well as Paste Flow Both layers have actually been effectively soldered Switch off hot pad Wait for dual motherboard to cool down for 5 minutes Get a brand-new back glass assembly Mount the initial Face ID and also back camera parts Set up the motherboard and also connect the flex cables Obtain a brand-new battery set up Then Mount the original earphone amplifier and sensor setting up on the new monitor Attach the original screen to the extended display device Review Original display information with Real Tone repair work programmer As soon as done, attach the brand-new display to the extended display system Write the stored data of the original display to the new screen Connect the brand-new display Press the power button to transform on the phone Run the performance examination.
Whatever is great however the WiFi switch can not be toggled We require to unlink the WiFi Attach the iRepair DFU Box to the computer and also then attach the phone with the iRepair DFU Box Put the phone into DFU mode Open the software program Click on “DFU Form” and after that click “Question Details” Click “Unlock Wi-fi” to unlink WiFi Once done, click “Complete Diagnostic” Unplug phone Phone transforms on instantly WiFi change go back to normal apple iphone X restore completed efficiently.
