Recently, REWA Academy students offered comments that both layers commonly fall short to fit closely in double-stacked motherboard repair work There are also big gaps, triggering pseudo soldering In action, we will certainly share tips and notes when separating as well as recombining double-stacked motherboard Remove foam on the motherboard prior to heating Please be kept in mind that we do not suggest beginners to heat up the motherboard with a warm air gun Due to the fact that the motherboard may get warm erratically and also warp A professional motherboard home heating system is what we suggest To promote later on removal of the reasoning board, drive a screw on the logic board Puncture the tape with a Sculpture Blade The logic board as well as middle layer are soldered with low-temperature solder paste So the very best temperature level for the heating system will certainly be 155 ° C-165 ° C Push the reasoning board gently with tweezers when the temperature gets to 165 ° C If the logic board hangs, the tin has actually thawed Clamp the screw to remove the reasoning board Eliminate the signal board Get rid of thermal oil with a Sculpture Blade Thermal oil must be gotten rid of completely Otherwise, the thermal grease will certainly touch the logic board to trigger pseudo soldering in recombination Attach the signal board to the holder Use a round of Paste Flux Remove tin on the bonding pad with Soldering Iron at 365 ° C and also Solder Wick Tin on the bonding pad have to be completely eliminated The recurring tin will impact the subsequent soldering Tidy the bonding pad with PCB Cleanser Clean the logic board with the very same technique Please do not damage components around the bonding pad of the reasoning board while cleaning It is essential to check if the bonding pad is cool after cleaning Attach the signal board to the Reballing System Placed the reballing stencil in setting to make sure that it is pushing versus the signal board To stop the solder paste from moving into the motherboard void, place a metal plate Apply a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Remove the reballing stencil Inspect if solder paste on the signal board is full While applying solder paste, please make certain that solder paste need to have a specific humidity If the solder paste is as well dry, it will certainly abide by the reballing pattern when the pattern is gotten rid of As a result, the solder paste on the signal board will not be consistent, which can conveniently lead to bad soldering Put the signal board on the 165 ° C Home heating Platform to heat Quit home heating after the solder spheres are created Apply a percentage of Paste Flux after the signal board has actually cooled Align the logic board with the signal board Keep heating on the 165 ° C Heating Platform When the solder change spills and logic board sinks, push the logic board gently with tweezers to guarantee both layers fit very closely The push has to be mild and tiny Clean the motherboard with PCB Cleanser after the motherboard has cooled If you discover the motherboard warped while recombining, you can place the motherboard on a level board as well as fasten it with a rubber band Press two sides of the motherboard carefully To stay clear of crushing parts, please put a soft paper under the motherboard Following, we will share another recombination method The method can be taken if the middle bonding pad is not harmed When the tin thaws, get rid of the reasoning board in a vertical manner with tweezers It can be seen that there is a metal pad of 0.05 mm density around the signal board at a particular distance This metal pad is created to maintain a 0.05 mm space in between the logic board as well as the center layer, preventing the solder balls from linking while soldering You just require to remove thermal grease on the motherboard when the fixing is done Keep original tin on the bonding pad Use a percentage of Paste Change Lastly, line up the reasoning board with the signal board When the temperature level gets to 165 ° C and the tin melts, turn the power off Press two ends of the logic board with tweezers till the motherboard has actually cooled down The logic board and the signal board fit carefully in this way There will be no connecting and also solder spheres spillover Check out REWA Academy if you wish to discover more repair work abilities We have full program plans for motherboard medical diagnosis and repair work capability improvement Click the web link in the remark section to acquire motherboard fixing program plans Thanks for enjoying as well as feel cost-free to leave a comment
